CPU BASED COOLING
- Cold plate the liquid heat exchanger on the processor
- Extreme high heat loads
DIRECT TO CHIP LIQUID COOLING
- High density liquid cooling at the processor level
- Rack-mount or row-based liquid-to-liquid Cooling Distribution Units
- Rack manifolds to manage liquid distribution between CDU and cold plate loops suitable for various server or rack environments
- Enable 100% utilization of rack and data center spaces at high densities
- Facilitate peak performance for higher powered processors
Three Primary Modules
- Selection 1: Passive Cold plate Loop
- Selection 2: Rack Manifold
- Selection 3: Coolant Distribution Unit
Using the exceptional thermal Conductivity of warm liquid to provide dense cooling directly to server Components.
Each module designed to meet unique System level liquid cooling requirements.
- High Heat displacement up to 1.2 mW
- Reduce Total Cost of Ownership (TCO) and facility Operating Expenses (OPEX)
- Leak prevention and detection
- Redundant functionality, e.g., extra pumps
- Redundant functionality, e.g., extra pumps ASHRAE W5 warm Direct Liquid Cooling (2 – 50°C)
- Industrial-grade materials for reliability and longevity