DIRECT TO CHIP LIQUID COOLING

 

CPU BASED COOLING

  • Cold plate the liquid heat exchanger on the processor
  • Extreme high heat loads

DIRECT TO CHIP LIQUID COOLING

  • High density liquid cooling at the processor level
  • Rack-mount or row-based liquid-to-liquid Cooling Distribution Units
  • Rack manifolds to manage liquid distribution between CDU and cold plate loops suitable for various server or rack environments
  • Enable 100% utilization of rack and data center spaces at high densities
  • Facilitate peak performance for higher powered processors

 

 

Three Primary Modules

  • Selection 1: Passive Cold plate Loop
  • Selection 2: Rack Manifold
  • Selection 3: Coolant Distribution Unit

 

 

Using the exceptional thermal Conductivity of warm liquid to provide dense cooling directly to server Components.

Each module designed to meet unique System level liquid cooling requirements.

  • High Heat displacement up to 1.2 mW
  • Reduce Total Cost of Ownership (TCO) and facility Operating Expenses (OPEX)
  • Leak prevention and detection
  • Redundant functionality, e.g., extra pumps
  • Redundant functionality, e.g., extra pumps ASHRAE W5 warm Direct Liquid Cooling (2 – 50°C)
  • Industrial-grade materials for reliability and longevity